|
Advanced Embedded Modules
 |
Op 22 september neemt Alcom deel aan het D&E event in het Evoluon in Eindhoven.
Om 12 uur houdt Congatec namens Alcom een lezing over de AMD Fusion Technology.
Wilt u erbij zijn schrijf u dan nu in.
 
| New 3G iDigi Development Kit |
 |
| |
 |
|
Digi introduced the iDigi® Gateway Development Kit with 3G cellular connectivity. The kit demonstrates how remote devices can be connected wirelessly over cellular networks and integrated into a cloud environment with ease. It contains all of the hardware, software and documentation necessary for ZigBee-to-3G cellular Internet connectivity, iDigi Web services and Digi development tools.
The iDigi Gateway Development Kit is designed to make it easy to setup a ZigBee network, upload a custom iDigi Device Integration Application (iDigi Dia) and provide seamless connectivity to the iDigi Device Cloud™ for Web services integration to standard business applications over the Internet. Using the kit, in no time a user will be able to log into a Google App demo and remotely switch on/off a lamp and monitor its history using wireless Digi technologies. How to get started (video)
Product datasheets
|
| |
| New Modbus TCP is now Launched in JetNet 4508 V2 series |
 |
| |
 |
|
Korenix released Modbus TCP/IP in its JetNet 4508 V2 series industrial managed copper / fiber switches, aiming to provide users with enriched network connectivity and easy maintenance for factory automation. The ModBus TCP/IP registers supported in the new v1.1 firmware will enable administrators to connect to data acquisition system and read the switchs’ operating info using their own Modbus TCP/IP master program for monitoring and maintaining switch’s status...read more
|
| MultiConnect™ AW Analog-to-Wireless Converter |
 |
| |
 |
|
The MultiConnect™ AW analog-to-wireless converter is a convenient turnkey solution that allows legacy equipment with built-in analog modems to connect to the cellular packet data or circuit switched data networks. By emulating the traditional dial-up PSTN network and using integrated or external cellular modems, the affordable MultiConnect AW converter gives new life to devices currently using traditional analog dial-up communications. Datasheet: MultiConnect
|
| |
|
| Next generation Ultra-low-power products for wireless applications |
 |
| |
 |
|
Redpine is Your Wireless Partner!
- Leading Edge 802.11abgn Technology
- Ultra low power
- High performance
- Chipset, Modules & Systems
- Faster time to market with modules
- Migration path to chipset for cost reduction
- Customization Services
Overview
|
| |
Extremely Low Power embedded computing technology
|
 |
| |
 |
|
- MTP-1205 : Fanless 12,1" TFT multifunctional Touch Panel PC
- SPC-1505 : Full IP-65 Stainless Steel Chassis Fanless Touch Panel PC
- MPC-42W5 : 42" HD Intel Atom D525 Digital Signage Panel PC
|
| |
| 3U CompactPCI® 2nd Generation Intel® Core™ i7 Processor with ECC |
 |
| |
 |
|
The ADLINK cPCI-3970 Series is a 3U CompactPCI® PlusIO compatible processor blade with ECC memory up to 16GB. The ADLINK cPCI-3970 features a latest 2nd generation Intel® Core™ i7 processor with Mobile Intel® QM67 Express Chipset, supports Satellite mode operation as a standalone blade in peripheral slots and IPMI for system health monitoring.
Front panel I/O includes 2x GbE, 2x USB, VGA, and additional 2x USB, COM, KB/MS, and Line-in/out for the 8HP cPCI-3970D model, or 2x DisplayPort, COM and USB for the cPCI-3970G version. One optional PCI 32-bit/66 MHz PMC site or PCI-Express x1 XMC site is available on selected 8HP and 12HP skus. The cPCI-R3P00 Rear Transition Module (RTM), provides 3x SATA, 2x GbE, 2x USB, 2x COM and VGA for conventional CompactPCI applications.The cPCI-3970 is a high performance solution for applications such as transportation, industrial control and automation that require superior data transfer capabilities, computing power, high-end 2D/3D multiple display, reliable ECC memory and IPMI system management. Datasheet: cPCI-3970
|
| 15inch Waterproof Stainless steel enclosure display |
 |
| |
 |
|
Designed with food manufacturing applications in mind, the ADP-1153 15" colour TFT monitor has full IP65 and CE / FCC Class A rating and boasts 1024 x 768 resolution with 300 cd/m² brightness. The rugged monitor also features a stainless steel housing and VESA mounting along with VGA Input and rear OSD controls. Product Brief
|
| Open frame and boxed embedded systems |
 |
| |
 |
|
CUPID open frame are ARM11 based embedded systems with either a 5.7" or 7.0" touch display. Both, display and PCB are mounted onto a subplate made of stainless steel. The PCB is protected by a cover of the same material. Our open frame systems are designed for customers, who want to install a ready-to-run kit into their own end-devices.
CUPID boxed are ARM9 based embedded systems with either a 5.7" or 7.0" touch display. The display is protected by a Polyester film, which is glued into the anodized Aluminium frame. The back side of the film is coloured in Garz & Fricke standard design, its front is anti-scratch protected. The back cover is made of stainless steel.
Features:
- 5.7" | 7.0" (145|178 mm) Touch Display
- 532 MHz ARM11 CPU (i.MX35)
- 128 MB RAM / 256 MB ROM
- 2x RS-232, RS-485, CAN, USB
- SPI, I2C, Ethernet, SD, Audio, Digital I/O
- Power-over-ethernet
|
| iSMART TFT Modules |
 |
| |
 |
|
Noritake Itron has developed an object oriented language specifically designed to control TFT display modules enabling rapid application development through easy image, text and function handling.
- ARM 9 core
- Low profile modules
- 7 interfaces + 24 user I/O
- 5yr+ product platform availability
- Fast access 64Mbyte display memory
- Reusable display pages & menus
iSmart TFT modules brochure
Available sizes: 3.5", 4.3", 5.7", 7"
|
| ARM11 module with i.MX35 |
 |
| |
 |
|
The TQMa35 Minimodule, based on the Freescale i.MX35 processor, offers a balanced ratio between computing and graphic performance. The basis for this is a ARM 11 core with up to 532 MHz. With the high level of interface and function integration in the CPU a large number of interfaces and module functions are implemented. This allows the basic board to be developed easily and at low-cost. All the processor’s functional pins are on the module plug-in connector. Datasheet: TQMa35
- All CPU interfaces are available
- Extended boot options (USB, SD Card)
- Extended temperature range
- eMMC Flash
- Low power consumption (typ. 2-3W)
- Long-term availability
|
| |
|
|
|
|
| PXA270M/PXA270 Module Replacements |
 |
| |
 |
|
This cost-effective i.MX25 module with preinstalled operating system represents the III.generation of the embedded devices from Voipac, that have been increasingly attracting interest of various industry segment users because of the quick set-up and easy-to-handle programming of own applications.
The i.MX51 based module represents optimal performance and cost-effective solution for embedded systems. With preinstalled operating system and running up to 800MHz, the module enables almost anyone to design new product with quick set-up and easy-to-handle programming of own applications.
|
| |
|
|
