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Thursday, August 25th 2011

Advanced Embedded Modules

 

 

 

Op 22 september neemt Alcom deel aan het D&E event in het Evoluon in Eindhoven.

Om 12 uur houdt Congatec namens Alcom een lezing over de AMD Fusion Technology.

Wilt u erbij zijn schrijf u dan nu in.

EDITO

Top M2M & WIRELESS
Wi-Fi Version of Popular XBee Module Logo
 
 

Digi introduced the XBee® Wi-Fi, an embedded module that enables industry leading low power, serial-to-Wi-Fi networking in the popular XBee form factor. Because of the XBee’s common footprint and application programming interface (API), customers can now create a single board design for wireless products that supports 802.15.4, ZigBee, ZigBee Smart Energy, 2.4 GHz, 900 and 868 MHz, Wi-Fi and proprietary DigiMesh protocols.

Datasheet: XBee Wi-Fi

 
Korenix JetWave 2420 series ruggedized 802.11b/g Wireless APs extend Reliable Wireless Data up to 10KM! Logo
 
 

Korenix offers JetWave 2420 and JetWave 2420S IEEE802.11b/g compatible outdoor Wireless Access points capable of providing up to 54Mbps high-speed, secure wireless communication using 2.4GHz direct sequence technology. Users can benefit from the high output power to extend wireless data coverage from 5 up to 10KM while linking two or more separate networks to create a single LAN network more efficiently.

Datasheet: JetWave 2420/2420S

 
Bluegiga Technologies speeds up the development of wireless Bluetooth based iOS accessories Logo
 
 

Bluegiga Technologies introduces a new version of the iWRAPTM Bluetooth stack with enhanced connectivity for Apple’s line of iOS enabled devices. The new firmware will allow developers to quickly create Bluetooth accessories for popular devices such as the iPhone, iPad or iPod Touch.

The iWRAP Bluetooth stack incorporates two new features: First, Bluegiga’s Bluetooth modules with iWRAP can directly interface to the Apple authentication co-processor and perform initial authentication of the Bluetooth connection, enabling the host processor to perform other tasks. Second, the iWRAP Bluetooth stack implements Apple’s iAP protocol for communication between the iOS device and the Bluetooth enabled accessory simplifying application development for the accessory designer.

More information

 
Connecting Anything 2 Anything Logo
 
 

When you want to get connected, turn to Sierra Wireless, the leader in M2M.  With the broadest offering of wireless hardware, software, and services we get you to market on time and on budget.

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iDigi Gateway Development Kit Logo
 
 

The iDigi Gateway Development kit includes:

Video

 
GPRS Remote Terminal Unit (RTU) for industrial environment
 
 

The Maestro Industrial 10 is a GPRS Remote Terminal Unit (RTU) for industrial environment offering two SIM slots for automatic network failover and data logging SD card slot. Fully programmable inputs, timers, counters and alarms provide a very powerful control tool and future-proof solution for industrial applications in the telemetry, SCADA, security, farming, home and office automation industries.

MI10 Datasheet

 
Taoglas launched the FXP.830 a powerful, flexible antenna with 80% efficiency for the M2M wireless device and module market
 
 

This antenna is unique in the market because it is made from Taoglas’ flexible polymer material, has a tiny form factor (42*7*.01 mm), an efficiency of 80% and a 3dBi peak gain. It maintains excellent performance even in tight and awkward spaces.

The FXP830 is a small, dual-band, dipole antenna for 2.4/5.8 GHz band including WiFi, Zigbee and WLAN. Its efficiency of 80% compares to 10-15% efficiency of competing chip antennas and 20-30% efficiency of pifa and loop antennas. It has a tiny form factor and has double-sided 3M tape on one side for easy “peel and stick mounting. This makes the FXP830 ideal for fast and easy implementation particularly in devices where space is at a premium, e.g. sensors, nodes, cameras etc. It is perfect for:
• Telemedical and telehealth – including body worn devices
• Mesh networking and remote monitoring
• M2M (Bluetooth, Zigbee, WiFi) module providers for high reference performance
• Security
• Smart Metering

Specifications: FXP830

 
Top TFT & EMBEDDED COMPUTING
New conga-EAF module provides broad scalability for ETX standard Logo
 
 

Congatec is guaranteeing a sustainable future and broad scalability for the ETX standard with the launch of the conga-EAF Computer-on-Module (COM). With a choice of seven AMD G-Series processors, the conga-EAF also offers the best price/performance ratio. Ranging from the AMD T56N 1.6 GHz Dual Core (L1 cache 64KB, L2 Cache 512KB x2, 18 W) multi-core processor to the AMD G-T40R 1.0 GHz (L1 cache 64KB, L2 cache 512KB, 5.5W) single-core processor with extremely low power consumption, the conga-EAF provides a perfect form-fit function setup for ETX. congatec is thereby granting all ETX applications a life-time extension into a second generation.

Datasheet: conga-EAF

 
Rugged Embedded System with QM57 Chipset Logo
 
 

Avalue released a series of new rugged embedded system, EPS-QM57, which is ideal for a wide range of applications. The EPS-QM57 is equipped with the Intel CoreTM i7 processor with the Intel QM57 chipset, which has a low power consumption and is very energy-efficient. It supports up to 8GB DDR3 memory with a variety of I/O interfaces.

Features:

  • Support Intel® Core™ i7-620LE 2.0GHz with 4MB Cache CPU/ Intel® Celeron® P4505 1.86GHz with 2MB Cache CPU
  • Intel® QM57 Chipset
  • Two 204-pin SODIMMs Up to 8GB DDR3 800/ 1066 SDRAM
  • 5.1-CH HD Audio, Dual Gigabit Ethernet
  • 1 CFast, 1 SATA, 8 COM, 6 USB, 1 LPT, 2 PCI, 1 x SIM Card, 8-bit/ 16-bit DIO
  • Fanless Operation
  • -10 ~ +55°C Wide Temperature Operation
  • Rugged Design for Vibration/ Shock Protection
  • Options: PCIex16 Riser Card, Table Mount Bracket

Datasheet: EPS-QM57

 
Extremely small and powerful ARM9 microprocessor Logo
 
 

The TQMa28 Minimodule, based on the i.MX28 pro­cessor, offers a balanced ratio between computing and graphic performance. The basis for this is an ARM926 core with up to 450 MHz. The realised memory on the module provides best system support. The module is best suited for smart metering and for easy visualization and control applications. A large number of interfaces and module functions are imple­mented in the CPU due to the high level of interface and function integration. This allows the basic board to be developed easily and at low-cost. All the processor’s functional pins are on the module plug-in connector.

TQMa28 shortform

 
PICMG 1.3 platform with higher computing power and maximum data access bandwidth Logo
 
 

NuPRO-E340 is the latest Intel Core i7/i5/i3 product. It provides quad-core CPU capability, DDR3 bandwidth, PCI Express expansion and next-generation I/O ports.Unlike Q57 based product, our product is ideal for vision applications.

Features:

  • Intel® Q67 Express chipset supporting PCI Express 2.0
  • IntelR Rapid Storage Technology, supports RAID 0/1/5/10
  • 6x COM ports (including 1x RS-232/422/485/485+)
  • Supports USB 3.0 with 5 Gb/s data transfer rate
  • Supports Serial ATA with 6.0 Gb/s data transfer rate

Datasheet: NuPRO-E340

 
Mini-ITX board with Nano X2 E-series dual core CPU Logo
 
 

First Nano X2 E Dual Core Mini-ITX Embedded Board
Mini-ITX Board with Nano X2 E CPU, Full HD Video, SATA, GigaLAN, COM, USB, VGA, HDMI, LVDS & PCIe

Features:

  • 1.6GHz VIA Nano™ X2 E (with fansink)
  • VIA VX900 Unified Digital Media IGP chipset
  • Support blue-ray audio codec
  • Supports DDR3 memory, up to 8GB
  • Supports four COM ports (three as pin headers)
  • Supports one PCI and one PCIe x16 slot

Datasheet EPIA-M900

 
VIA AMOS-5001 Modular Chassis Wins Award Logo
 
 

VIA AMOS-5001 modular chassis kit has been awarded the PC/104 and Small Form Factors magazine Editor's Choice award, published in the Summer 2011 Resource Guides issue of PC/104 and Small Form Factors magazine. On top, VIA Technologies has made prototyping hardware and software designs easier with the VIA AMOS-5001 chassis kit. Whether or not the final design uses VIA’s x86 CPUs or the Em-ITX form factor, it’s still a useful platform to begin with and makes that whole getting started thing much more doable.

Datasheet AMOS-5001

 
Rugged Embedded System for Intelligent Transportation System Logo
 
 

Avalue released a series of new rugged embedded system, ERS-AT270-A2, which is used in Intelligent Transportation System.

ERS-AT270-A2 is powered by Intel ® Atom™ N270 processor with Intel® 945GSE + ICH7-M, which consumes low power consumption and is energy-efficient. It is embedded with the scalable EPIC computer with 6 sets of COM ports by EPI-945GSE and 6 sets of COM ports by LPC-Module. Not only 4 USB ports but also 12COM ports, ERS-AT270-A2 is ideal rugged embedded system for intelligent transportation system requirement.

Features:

  • Onboard Intel® Atom™ N270 1.6GHz CPU
  • Onboard Intel® 945GSE/ ICH7-M Chipset
  • One 200-pin SODIMM Supports Up to 2GB DDR2 533 SDRAM
  • Dual Gigabit Ethernet, 5.1-CH HD Audio
  • 1 VGA, 1 LVDS, 1 SATA, 12 COM, 4 USB
  • 1 LPT, 2 PS/2, 1 CF, 16-bit GPIO
  • Service Windows, Easy to Install HDD and Memory
  • 0 ~ 50°C Fanless Operation, Ambient w/ air flow
  • 1 DC-in 9 ~ 32V, 1 DC-out 12V

Datasheet: ERS-AT270-A2

 
8-inch (4:3) and 15.6-inch (16:9) Smart Panels with x86 and ARM CPUs
 
 

Smart Panels incorporate an LCD touch panel, industrial motherboard and Internet access. Among the key benefits of Smart Panel equipped devices are reduced design burden, fewer BOM items, decreased risk, faster time to market, and minimized NRE costs. The Smart Panel is a base component that provides a building block for system integrators for develop their end-user devices, implementing their final application requirements for devices such as medical instruments, POS systems, test instruments, automation devices, tabletop ordering systems, and banking systems. Customers who currently purchase a motherboard and display module for assembly into final products can recognize the increased value represented by Smart Panel deployment.

Smart Panels
Specificatons

 
COM Express Module; I7 CPU for rugged environments
 
 

The Toucan-QM57 is a powerful COM Express module with an Intel Core i7 processor. The module is specifically built for applications within rugged environments. This is underlined by the integration of a highly ruggedized new memory module – XR-DIMM™. Standardized by SFF-SIG, these memory modules come with a high-quality connector and can tightly be fastened by screws. The raw computation performance of the Toucan-QM57 lends itself to image processing, video encoding, and other demanding applications. The integrated LEMT condition monitoring features real time tracing of the module’s current consumption.

Datasheet QM57

 
Top POWER CONVERSION
Convection cooling option for XL375 AC/DC power supply family Logo
 
 

N2Power announced availability of the Convection Cooling Option for its XL375 Series of very compact AC-DC switching power supplies. Eight models feature output voltages from 12V to 56V. The XL375 Series is designed for OEM applications such as industrial automation, telecommunications, gaming systems, security and surveillance systems, and network servers.

Datasheet: XL375

 
Cotek power supplies GE Series Logo
 
 

The GE series of switching power supplies are available in models from 25 to 150 watts. It features durable design that installs easily in compact spaces, AC input range 88 - 264VAC, high reliability and low ripple noise, high efficiency up to 90%, output short circuit, over voltage, overload protection and compliance to EPA Energy Star requirements for external power supplies.

Features:
• No-load power consumption < 0.5W
• Protections: short circuit / over load / over voltage
• Brown-out (low AC input voltage)
• Cooling by free air convection
• Power ON LED indicator
• High operation temperature up to 70°C
• 100% full load burn-in test
• Withstand 5G vibration test
• High efficiency, long life and high reliability
• All using 105°C long life electrolytic capacitors

Datasheet: GE Series

 

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